Technical Service
Material Processing and Preparation
It is a multifunctional processing and preparation platform integrating micron and nano processing and testing means. It is a technical support system for the development of electronic and optoelectronic devices, micro- and nano-optoelectronic systems, biochips and various sensors using micro- and nano-scale processing means.
Typical Equipment
Inductively Coupled Plasma Etching (ICP) equipment, and UV Contact Exposure Machine.
Inductively Coupled Plasma Etching Equipment (ICP)
Model: GSE C200
Synopsis:
Inductively Coupled Plasma Etcher (ICP) GSE C200 is a general-purpose ICP plasma etcher with high performance and multi-functionality manufactured by Beifang Huachuang Microelectronics Co. The equipment adopts inductively coupled plasma technology, through high-frequency glow discharge to decompose the reactive gas into active particles, to realize the precise etching of materials.GSE C200 is equipped with a dual RF source design, which can control the ion density and energy separately to optimize the etching effect. Its ICP power up to 3000W, RF power up to 1500W to ensure that the low pressure to achieve a high plasma density and low bombardment energy of the etching, thereby enhancing the etching rate and anisotropic etching performance, 8inch piece of non-uniformity of the etching: <±5%. GSE C200 is mainly used for 8 inches and below the size of the AlN, Mo, GaN, and other materials etc. The GSE C200 is mainly applied to 8 inches and below the size of a variety of materials such as the etching.